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Wire and Cable Technology Blog

The Wire and Cable Technology Blog is the place for conversation and discussion about power cables; cable assemblies; cable manufacturing & testing; and cable ducts, trays and accessories. Here, you'll find everything from application ideas, to news and industry trends, to hot topics and cutting edge innovations.

Infinera Offers Open Mobile Transport Solutions for 5G

Posted March 08, 2017 12:00 AM by Engineering360 eNewsletter

Infinera introduced a new range of flexponders for mobile fronthaul and a new EMXP Access Unit for mobile backhaul to extend the capabilities of XTM series-based solutions, providing investment protection, and meeting stringent performance requirements for mobile operators as networks scale to 5G.


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Vein Authentication Technology Reads Palm Veins

Posted February 03, 2017 12:00 AM by Engineering360 eNewsletter

Fujitsu Laboratories Ltd. reportedly developed the world's first slide-style palm vein authentication technology. This technology is compact enough to be equipped to future tablets and other handheld mobile devices. For some time, making the optical unit smaller had been difficult. 


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Silver Interconnects Replace Copper on Flexible Circuits

Posted November 22, 2016 12:00 AM by Engineering360 eNewsletter

Combining improvements in silver ink technology with advanced printing, a leading connector manufacturer has developed high-performance silver flexible circuits as an economical alternative to traditionally etched copper interconnects on polyimide and printed circuit boards. The newly developed process allows printing fine silver traces (0.13 mm) with equally small spacing (0.13 mm) on polyester substrates. Besides lowering the cost of manufacturing and eliminating the use of harsh chemicals, the silver printing process also allows the attachment of fine-pitch ICs on the polyester substrate using a proprietary bonding technique.


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Pushing the Limits of PCB Density

Posted October 26, 2016 12:00 AM by Engineering360 eNewsletter

To give printed circuit boards (PCBs) a boost in interconnect density, a leading Swiss manufacturer of PCBs has launched a new technology platform called DenciTec. It combines advances in thin-film technology with PCB manufacturing to create conductor widths and spacings down to 25 µm with copper thicknesses of 20+/-5 µm on all conductive layers. Additionally, laser-via diameters can be made as small as 35 µm along with copper-filled blind vias. Concurrently, the platform uses advanced materials to produce ultra-thin circuits with the highest product reliability.


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Wind Farm Networks Switch to Higher Voltage Cables

Posted July 27, 2016 12:00 AM by Engineering360 eNewsletter

As renewable energy gains momentum, wind farm operators need higher voltage cables to deliver high power from offshore platforms to mainland grids. To meet the growing demand, French cable manufacturer Nexans has developed a new range of inter-array cable systems operating at up to 72.5 kV. The new systems significantly cut losses compared to the traditional 33 kV cable. Incorporating separable T-connectors, coupling connectors, and surge arresters, the robust higher voltage cabling solution conforms to the requirements of the international standard IEC 60840.


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