CR4 - The Engineer's Place for News and Discussion ®



Wire and Cable Technology Blog

The Wire and Cable Technology Blog is the place for conversation and discussion about power cables; cable assemblies; cable manufacturing & testing; and cable ducts, trays and accessories. Here, you'll find everything from application ideas, to news and industry trends, to hot topics and cutting edge innovations.

Mouser, Renesas Team on MCUs, Design Tools for IoT

Posted March 29, 2017 12:00 AM by Engineering360 eNewsletter

Mouser Electronics will distribute Renesas' Synergy™ Platform to design engineers to speed time-to-market for Internet of Things (IoT), industrial, and real-time operating system-based applications.


Editor's Note: This news brief was brought to you by the Wire & Cable Technology eNewsletter. Subscribe today to have content like this delivered to your inbox.

Add a comment

Infinera Offers Open Mobile Transport Solutions for 5G

Posted March 08, 2017 12:00 AM by Engineering360 eNewsletter

Infinera introduced a new range of flexponders for mobile fronthaul and a new EMXP Access Unit for mobile backhaul to extend the capabilities of XTM series-based solutions, providing investment protection, and meeting stringent performance requirements for mobile operators as networks scale to 5G.


Editor's Note: This news brief was brought to you by the Wire & Cable Technology eNewsletter. Subscribe today to have content like this delivered to your inbox.

1 comments; last comment on 08/29/2017
View/add comments

Vein Authentication Technology Reads Palm Veins

Posted February 03, 2017 12:00 AM by Engineering360 eNewsletter

Fujitsu Laboratories Ltd. reportedly developed the world's first slide-style palm vein authentication technology. This technology is compact enough to be equipped to future tablets and other handheld mobile devices. For some time, making the optical unit smaller had been difficult. 


Editor's Note: This news brief was brought to you by the Wire & Cable Technology eNewsletter. Subscribe today to have content like this delivered to your inbox.

12 comments; last comment on 02/04/2017
View/add comments

Silver Interconnects Replace Copper on Flexible Circuits

Posted November 22, 2016 12:00 AM by Engineering360 eNewsletter

Combining improvements in silver ink technology with advanced printing, a leading connector manufacturer has developed high-performance silver flexible circuits as an economical alternative to traditionally etched copper interconnects on polyimide and printed circuit boards. The newly developed process allows printing fine silver traces (0.13 mm) with equally small spacing (0.13 mm) on polyester substrates. Besides lowering the cost of manufacturing and eliminating the use of harsh chemicals, the silver printing process also allows the attachment of fine-pitch ICs on the polyester substrate using a proprietary bonding technique.


Editor's Note: This news brief was brought to you by the Wire & Cable Technology eNewsletter. Subscribe today to have content like this delivered to your inbox.

Add a comment

Pushing the Limits of PCB Density

Posted October 26, 2016 12:00 AM by Engineering360 eNewsletter

To give printed circuit boards (PCBs) a boost in interconnect density, a leading Swiss manufacturer of PCBs has launched a new technology platform called DenciTec. It combines advances in thin-film technology with PCB manufacturing to create conductor widths and spacings down to 25 µm with copper thicknesses of 20+/-5 µm on all conductive layers. Additionally, laser-via diameters can be made as small as 35 µm along with copper-filled blind vias. Concurrently, the platform uses advanced materials to produce ultra-thin circuits with the highest product reliability.


Editor's Note: This news brief was brought to you by the Wire & Cable Technology eNewsletter. Subscribe today to have content like this delivered to your inbox.

Add a comment


Previous in Blog: Wind Farm Networks Switch to Higher Voltage Cables  
Show all Blog Entries in this Blog

Advertisement