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Semiconductor & MEMS Fabrication

The Semiconductor Fabrication Blog is the place for conversation and discussion about manufacturing processing equipment, semiconductor test and measurement, products & services, and semiconductor materials. Here, you'll find everything from application ideas, to news and industry trends, to hot topics and cutting edge innovations.

Graphene "Copy Machine" Creates Cheap Semiconductor Wafers

Posted May 12, 2017 12:00 AM by Engineering360 eNewsletter

The overall cost of wafer manufacturing is poised to decline with a new graphene-based “copy machine” that transfers intricate crystalline patterns from an underlying semiconductor wafer to a top layer of identical material. The technology supports fabrication of devices from exotic, higher-performing semiconductor materials.


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MEMS-based Microscope Shrinks Inspection Equipment Cost

Posted March 12, 2017 12:00 AM by Engineering360 eNewsletter

This MEMS-based device is about the size of a dime, and is mounted on a credit-card-sized printed circuit board that contains circuits, sensors, and other miniature components that control the microscope.


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Power Semiconductor Market in Automotive to Grow by $3 Billion by 2022

Posted February 17, 2017 12:00 AM by Engineering360 eNewsletter

A new report released by IHS Markit reveals that the global market for power semiconductors used in cars and light passenger vehicles will grow by more in $3 billion in the next six years.


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ON Semiconductor Showcases Solutions

Posted January 22, 2017 12:00 AM by Engineering360 eNewsletter

ON Semiconductor showcased its portfolio of solutions for the effective implementation of  USB Type-C applications at the 2017 Consumer Electronics Show. USB Type-C is the rapidly emerging default industry standard for wired, smart, rapid charging, and high-speed data transmission to support applications like augmented and virtual reality.


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Method to Dissipate Heat in Electronic Devices

Posted January 06, 2017 12:00 AM by Engineering360 eNewsletter

An international team of scientists has modified the energy spectrum of acoustic phonons — elemental excitations, also referred to as quasi-particles, that spread heat through crystalline materials like a wave — by confining them to nanometer-scale semiconductor structures.


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