|
Increasing complexity in semiconductor devices means that they consume ever more power and dissipate ever more heat. Heat sinks, fans, and other cooling mechanisms only delay the inevitable. Several techniques have been suggested that will help to break that cycle — multicore processors that give greater performance at a lower speed, bare die on a silicon substrate, and nanocircuitry made from DNA, to name a few. How will you reduce power consumption in your next-generation devices? How quickly will your product mix shift toward these new designs? How will you recoup your development costs amid the commodity-level price patterns of electronic products?
The preceding article is a "sneak peek" from Semiconductor & MEMS Fabrication, a newsletter from GlobalSpec. To stay up-to-date and informed on industry trends, products, and technologies, subscribe to Semiconductor & MEMS Fabrication today.
| 
