3-D Self-Assembling Structures Could Lead to New Microchips
Posted June 08, 2012 8:09 AM
From Phys.org - latest science and technology news stories:
Researchers at MIT have found a new way of making complex three-dimensional structures using self-assembling polymer materials that form tiny wires and junctions. The work has the potential to usher in a new generation of microchips and other devices made up of submicroscopic features.