Login | Register
The Engineer's Place for News and Discussion®


Engineering News

Latest news of interest to engineers. Sourced from GlobalSpec's Engineering News

Previous in Blog: Plants May Be Able to 'Hear' Others   Next in Blog: New CERN Results On Rare B Decays: A Tombstone To SUSY ?
Close

Comments Format:






Close

Subscribe to Discussion:

CR4 allows you to "subscribe" to a discussion
so that you can be notified of new comments to
the discussion via email.

Close

Rating Vote:







3-D Self-Assembling Structures Could Lead to New Microchips

Posted June 08, 2012 8:09 AM

From Phys.org - latest science and technology news stories:

Researchers at MIT have found a new way of making complex three-dimensional structures using self-assembling polymer materials that form tiny wires and junctions. The work has the potential to usher in a new generation of microchips and other devices made up of submicroscopic features.

Read the whole article and watch the video

Reply

Interested in this topic? By joining CR4 you can "subscribe" to
this discussion and receive notification when new comments are added.

Previous in Blog: Plants May Be Able to 'Hear' Others   Next in Blog: New CERN Results On Rare B Decays: A Tombstone To SUSY ?