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Packaging & Labeling Blog

Packaging & Labeling

The Packaging & Labeling Blog is the place for conversation and discussion about Automation & Control; Rigid & Flexible Containers; Labeling & Coding; Packing Machinery as used in the packaging industry. Here, you'll find everything from application ideas, to news and industry trends, to hot topics and cutting edge innovations.

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A Network Approach to Packaging R&D

Posted October 30, 2016 12:00 AM by Engineering360 eNewsletter

Dow Chemical's "Pack Studios" are designed to promote collaboration on packaging challenges, bringing together teams in package design, materials, brand owners, and equipment makers, among others. The newest Pack Studio will focus on laminating adhesive technologies, aiming to speed development and testing of approaches that could cut costs and shorten cycle times.


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Previous in Blog: Pressurized Liquid Poised to Alter Blow-molding Landscape  

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