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 With a budget of $12.8 million (U.S.), the Japanese Ministry has unearthed a five-year project for developing 3D semiconductor chips, which are predicted to be not only smaller, but also 10× faster than current chips. The top semiconductor companies, including Fujitsu and Toshiba, will be tapped to develop smaller, more powerful devices that run cell phones for a month without charging, control robot caregivers, and help autos avoid accidents and gridlock. Inevitably, the U.S. and other countries are also in rapid pursuit of this 3D technology, as previously referenced in 3D Chip-Stacking Breakthrough in the May issue of this newsletter.
The preceding article is a "sneak peek" from Solutions for Industrial Computing, a newsletter from GlobalSpec. To stay up-to-date and informed on industry trends, products, and technologies, subscribe to Solutions for Industrial Computing today.
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