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From ScienceDaily: Latest Science News:
Researchers are developing a new method to produce ~50µm thin crystalline silicon wafers for use in solar cells. The process involves mechanically initiating and propagating a crack parallel to the surface of a Si wafer. In this way, Si foils with an area of 25cm² and a thickness of 30-50µm have already been produced. The method makes use of industrially available tools (screen printer, belt furnace) and is potentially kerf-loss free.
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