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Embedded Now Blog

Blog of the Embedded Computing Industry - News, New Products, and Market Trends

Embedded NOW is the official blog of Embedded Computing Design magazine, where editors and special contributors sound-off on the latest buzz in the embedded computing industry. Embedded Computing Design is the industry's resource for the latest news, engineering methods, new products, and tools necessary for the design of small embedded modules to distributed, large-scale embedded systems.

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Rethink Cool - Intel® Atom™ Meets Tough Design Requirements

Posted September 26, 2008 5:10 PM by mavella

As processor technology becomes more mobile appropriate, it opens up new doors for all kinds of applications. More processing power makes it easier for these devices to be more intelligent and to communicate wirelessly amongst themselves. The growth in intelligent mobile devices of all types is going to be phenomenal in the coming years. But, bany issues exist that hinder the development and growth of mobile devices.

To be mobile, they must be small and lightweight. They have unique thermal constraints because of the size. You can't simply throw large heat sinks and heat pipes on them to disperse the heat from the processors and chipsets. Fan are not good. They create a long list of design challenges that are more easily addressed by taking them out of the equation. Who wants a fan making noise and constraining how the device is used so as not to block the airflow?

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