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Agilent's exit from the inspection end of the test industry leaves few options for anyone who wants to use that technique. Teradyne is the only major player remaining in AXI, and none of the big companies offer AOI systems anymore. Nevertheless, inspection gained in popularity in recent years for valid reasons. Devices are enormously complex, and solder-joint defects still represent a significant fraction of board-level problems. Device nodes are often conveniently located under the devices and out of sight. Insisting that designers provide in-circuit access at the board level still falls on deaf ears. Do you inspect your boards now? Do you intend to continue? How will your test-strategy change with fewer equipment choices?
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