<?xml version="1.0" encoding="UTF-8"?><rss version="2.0" xmlns:dc="http://purl.org/dc/elements/1.1/"><channel><title>CR4 - Blog&#x3a; Semiconductor &#x26; MEMS Fabrication</title><link>https&#x3a;&#x2f;&#x2f;cr4.globalspec.com&#x2f;blog&#x2f;85&#x2f;Semiconductor-MEMS-Fabrication</link><description><![CDATA[&#x3c;p&#x3e;The Semiconductor Fabrication Blog is the place for conversation and discussion about manufacturing processing equipment, semiconductor test and measurement, products &#x26;amp&#x3b; services, and semiconductor materials. Here, you&#x27;ll find everything from application ideas, to news and industry trends, to hot topics and cutting edge innovations.&#x3c;&#x2f;p&#x3e;]]></description><copyright>Copyright 2026</copyright><pubDate>Fri, 12 May 2017 04:00:00 EST</pubDate><generator>https&#x3a;&#x2f;&#x2f;cr4.globalspec.com</generator><item><title><![CDATA[Graphene &#x22;Copy Machine&#x22; Creates Cheap Semiconductor Wafers]]></title><link><![CDATA[https&#x3a;&#x2f;&#x2f;cr4.globalspec.com&#x2f;blogentry&#x2f;28331&#x2f;Graphene-Copy-Machine-Creates-Cheap-Semiconductor-Wafers&#x3f;from_rss&#x3d;1]]></link><description><![CDATA[The overall cost of wafer manufacturing is poised to decline with a new graphene-based &#x26;ldquo&#x3b;copy machine&#x26;rdquo&#x3b; that transfers intricate crystalline patterns from an underlying semiconductor wafer to a top layer of identical material. The technology supports fabrication of devices from exotic, hig]]></description><pubDate>Fri, 12 May 2017 04&#x3a;00&#x3a;00 EST</pubDate><guid><![CDATA[https&#x3a;&#x2f;&#x2f;cr4.globalspec.com&#x2f;blogentry&#x2f;28331&#x2f;Graphene-Copy-Machine-Creates-Cheap-Semiconductor-Wafers]]></guid><dc:creator>Engineering360 eNewsletter</dc:creator><dc:subject>Semiconductor &#x26; MEMS Fabrication</dc:subject></item><item><title><![CDATA[MEMS-based Microscope Shrinks Inspection Equipment Cost]]></title><link><![CDATA[https&#x3a;&#x2f;&#x2f;cr4.globalspec.com&#x2f;blogentry&#x2f;28131&#x2f;MEMS-based-Microscope-Shrinks-Inspection-Equipment-Cost&#x3f;from_rss&#x3d;1]]></link><description><![CDATA[This MEMS-based device is about the size of a dime, and is mounted on a credit-card-sized printed circuit board that contains circuits, sensors, and other miniature components that control the microscope.&#xa;&#xa;&#xd;&#xa;-------&#xa;&#xa;Editor&#x27;s Note&#x3a; This news brief was brought to you by the Semiconductor &#x26;amp&#x3b; MEMS F]]></description><pubDate>Sun, 12 Mar 2017 05&#x3a;00&#x3a;00 EST</pubDate><guid><![CDATA[https&#x3a;&#x2f;&#x2f;cr4.globalspec.com&#x2f;blogentry&#x2f;28131&#x2f;MEMS-based-Microscope-Shrinks-Inspection-Equipment-Cost]]></guid><dc:creator>Engineering360 eNewsletter</dc:creator><dc:subject>Semiconductor &#x26; MEMS Fabrication</dc:subject></item><item><title><![CDATA[Still Searching for Breakthrough Battery Technology]]></title><link><![CDATA[https&#x3a;&#x2f;&#x2f;cr4.globalspec.com&#x2f;blogentry&#x2f;27506&#x2f;Still-Searching-for-Breakthrough-Battery-Technology&#x3f;from_rss&#x3d;1]]></link><description><![CDATA[Industry news sources continue to report proposed alternatives to the lithium-ion batteries that power everything from laptops to electric cars. The latest candidate, lithium-sulfur batteries &#x28;Li-S&#x29;, can store 4x the energy per unit mass of the Li-ion variety and can work at high temperatures withou]]></description><pubDate>Fri, 19 Aug 2016 04&#x3a;00&#x3a;00 EST</pubDate><guid><![CDATA[https&#x3a;&#x2f;&#x2f;cr4.globalspec.com&#x2f;blogentry&#x2f;27506&#x2f;Still-Searching-for-Breakthrough-Battery-Technology]]></guid><dc:creator>Engineering360 eNewsletter</dc:creator><dc:subject>Semiconductor &#x26; MEMS Fabrication</dc:subject></item><item><title><![CDATA[Researchers Score Next-generation Semiconductor]]></title><link><![CDATA[https&#x3a;&#x2f;&#x2f;cr4.globalspec.com&#x2f;blogentry&#x2f;27450&#x2f;Researchers-Score-Next-generation-Semiconductor&#x3f;from_rss&#x3d;1]]></link><description><![CDATA[In searching for the next great semiconductor, researchers may have found a candidate nearer at hand than they expected. Diamond crystals dissipate heat much more rapidly than other materials can, allowing manufacturers to avoid relying on heat sinks and other encumbrances to keep devices from overh]]></description><pubDate>Fri, 29 Jul 2016 04&#x3a;00&#x3a;00 EST</pubDate><guid><![CDATA[https&#x3a;&#x2f;&#x2f;cr4.globalspec.com&#x2f;blogentry&#x2f;27450&#x2f;Researchers-Score-Next-generation-Semiconductor]]></guid><dc:creator>Engineering360 eNewsletter</dc:creator><dc:subject>Semiconductor &#x26; MEMS Fabrication</dc:subject></item><item><title><![CDATA[Researchers Score Next-generation Semiconductor]]></title><link><![CDATA[https&#x3a;&#x2f;&#x2f;cr4.globalspec.com&#x2f;blogentry&#x2f;27432&#x2f;Researchers-Score-Next-generation-Semiconductor&#x3f;from_rss&#x3d;1]]></link><description><![CDATA[In searching for the next great semiconductor, researchers may have found a candidate nearer at hand than they expected. Diamond crystals dissipate heat much more rapidly than other materials can, allowing manufacturers to avoid relying on heat sinks and other encumbrances to keep devices from overh]]></description><pubDate>Mon, 25 Jul 2016 04&#x3a;00&#x3a;00 EST</pubDate><guid><![CDATA[https&#x3a;&#x2f;&#x2f;cr4.globalspec.com&#x2f;blogentry&#x2f;27432&#x2f;Researchers-Score-Next-generation-Semiconductor]]></guid><dc:creator>Engineering360 eNewsletter</dc:creator><dc:subject>Semiconductor &#x26; MEMS Fabrication</dc:subject></item><item><title><![CDATA[Chips in Terahertz Gap Promise 10x Wireless Speed Increase]]></title><link><![CDATA[https&#x3a;&#x2f;&#x2f;cr4.globalspec.com&#x2f;blogentry&#x2f;27281&#x2f;Chips-in-Terahertz-Gap-Promise-10x-Wireless-Speed-Increase&#x3f;from_rss&#x3d;1]]></link><description><![CDATA[Because of graphene&#x27;s plethora of unique electrical properties, researchers are finding new applications almost every day. Taking advantage of both its opacity and transparency to electromagnetic waves, these researchers have developed new chips - now undergoing testing - that filter out unwanted r]]></description><pubDate>Mon, 30 May 2016 04&#x3a;00&#x3a;00 EST</pubDate><guid><![CDATA[https&#x3a;&#x2f;&#x2f;cr4.globalspec.com&#x2f;blogentry&#x2f;27281&#x2f;Chips-in-Terahertz-Gap-Promise-10x-Wireless-Speed-Increase]]></guid><dc:creator>Engineering360 eNewsletter</dc:creator><dc:subject>Semiconductor &#x26; MEMS Fabrication</dc:subject></item><item><title><![CDATA[Ready or Not, Memristors Are Coming]]></title><link><![CDATA[https&#x3a;&#x2f;&#x2f;cr4.globalspec.com&#x2f;blogentry&#x2f;27181&#x2f;Ready-or-Not-Memristors-Are-Coming&#x3f;from_rss&#x3d;1]]></link><description><![CDATA[Eight years ago, Hewlett-Packard unveiled a revolutionary replacement for conventional transistors - the memristor, a non-volatile memory-chip replacement that offers speed and durability and stores multiple data levels in a single cell. Even more exciting, its architecture allows building processo]]></description><pubDate>Tue, 26 Apr 2016 04&#x3a;00&#x3a;00 EST</pubDate><guid><![CDATA[https&#x3a;&#x2f;&#x2f;cr4.globalspec.com&#x2f;blogentry&#x2f;27181&#x2f;Ready-or-Not-Memristors-Are-Coming]]></guid><dc:creator>Engineering360 eNewsletter</dc:creator><dc:subject>Semiconductor &#x26; MEMS Fabrication</dc:subject></item><item><title><![CDATA[Building Chips Up Instead of Out]]></title><link><![CDATA[https&#x3a;&#x2f;&#x2f;cr4.globalspec.com&#x2f;blogentry&#x2f;27033&#x2f;Building-Chips-Up-Instead-of-Out&#x3f;from_rss&#x3d;1]]></link><description><![CDATA[You plan to build a large office building in a densely populated city. Expect that real estate limitations will prevent you from creating a large horizontal structure - so you build up.&#xd;  Several companies are adopting that approach for manufacturing &#xd; electronic devices. Although the idea isn&#x27;t new]]></description><pubDate>Mon, 14 Mar 2016 04&#x3a;00&#x3a;00 EST</pubDate><guid><![CDATA[https&#x3a;&#x2f;&#x2f;cr4.globalspec.com&#x2f;blogentry&#x2f;27033&#x2f;Building-Chips-Up-Instead-of-Out]]></guid><dc:creator>Engineering360 eNewsletter</dc:creator><dc:subject>Semiconductor &#x26; MEMS Fabrication</dc:subject></item><item><title><![CDATA[3D Chip Growth Optimizes Real Estate]]></title><link><![CDATA[https&#x3a;&#x2f;&#x2f;cr4.globalspec.com&#x2f;blogentry&#x2f;26942&#x2f;3D-Chip-Growth-Optimizes-Real-Estate&#x3f;from_rss&#x3d;1]]></link><description><![CDATA[For several years, the inexorable drive to reduce the board real estate that chips occupy while extending device functionality has driven the growth of 3D designs, such as microelectromechanical systems &#x28;MEMS&#x29;, image sensors, and memories, with the layers connected via through-silicon vias &#x28;TSVs&#x29;.]]></description><pubDate>Wed, 10 Feb 2016 05&#x3a;00&#x3a;00 EST</pubDate><guid><![CDATA[https&#x3a;&#x2f;&#x2f;cr4.globalspec.com&#x2f;blogentry&#x2f;26942&#x2f;3D-Chip-Growth-Optimizes-Real-Estate]]></guid><dc:creator>Engineering360 eNewsletter</dc:creator><dc:subject>Semiconductor &#x26; MEMS Fabrication</dc:subject></item><item><title><![CDATA[14, 10, and 7 Nanometers &#x2014; Oh My&#x21;]]></title><link><![CDATA[https&#x3a;&#x2f;&#x2f;cr4.globalspec.com&#x2f;blogentry&#x2f;26590&#x2f;14-10-and-7-Nanometers-Oh-My&#x3f;from_rss&#x3d;1]]></link><description><![CDATA[In the 50 years since Gordon Moore formulated his famous law, the semiconductor industry has often struggled to achieve the predicted advances. Predictions abound that the law has run out of steam, usually blaming the increasingly inconvenient, apparently immutable, laws of physics. Lately, however]]></description><pubDate>Fri, 23 Oct 2015 04&#x3a;00&#x3a;00 EST</pubDate><guid><![CDATA[https&#x3a;&#x2f;&#x2f;cr4.globalspec.com&#x2f;blogentry&#x2f;26590&#x2f;14-10-and-7-Nanometers-Oh-My]]></guid><dc:creator>Engineering360 eNewsletter</dc:creator><dc:subject>Semiconductor &#x26; MEMS Fabrication</dc:subject></item></channel></rss>