Grinding Sintered Silicon Nitride Using Diamond Tool

You start with a big pile of silicon nitride, a pallet of diamond tools, and a machine with lots of coolant. Most important is to have a notebook where you enter in the information for each test where you only vary one of the factors while you monitor the parameters of most interest to you.

Good luck with your quest.

Or you employ any one of the more competent search engines and commence with your education.

http://rd.springer.com/article/10.1007%2Fs11740-009-0183-z

Production Process

Production Engineering

December 2009, 3:411

First online: 27 October 2009

A study of grinding silicon nitride and cemented carbide materials with diamond grinding wheels

• Dirk Biermann
• , Evelyn Würz

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Abstract

This paper presents selected results of the grinding of silicon nitride and cemented carbide materials with diamond grinding wheels, which will in later research be extended to the grinding of ceramic-cemented carbide compound drill tools. In these fundamental experiments four different types of diamond grinding wheels were used in face grinding processes. The diamond grinding wheels vary by the grain size, the grain concentration and the bonding material. The relevant influencing variables such as the cutting and feed speed and the coolant supply method were varied to investigate the effect on grinding of the two different workpiece materials, the brittle silicon nitride workpiece material and the ductile cemented carbide workpiece material. Some factors, which have significant effects, like the radial wear of the grinding wheel, the components of the grinding forces, the normal and the tangential grinding force, and the surface quality of the ground workpieces are discussed in detail.

and . . . .

Journal of Materials Processing Technology

Volume 141, Issue 3, 1 November 2003, Pages 329-336

High speed grinding of silicon nitride with resin bond diamond wheels

• Han Huang^a,
• Ling Yin^a,
• Libo Zhou^{b, ,}

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doi:10.1016/S0924-0136(03)00284-X
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Abstract

This paper reports on the high speed grinding performance of silicon nitride using resin bond diamond wheels. The investigation focuses on the effect of wheel speeds on material removal mechanisms and ground surface quality. With a wheel of grit size 160 μm, the effect of wheel speed on the ground surface quality was insignificant because brittle fracture was prevalent during grinding. When using a wheel of grit size 20 μm, the ground surfaces exhibited predominantly ductile flow and were significantly influenced by wheel speed. The maximum chip thickness was used to interpret the associated material removal mechanisms. It was also found that the spindle vibration caused by high wheel speeds could limit the improvement of surface quality.

Keywords

• High speed grinding;
• Silicon nitride;
• Maximum chip thickness;
• Removal mechanism

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Copyright © 2003 Elsevier Science B.V. All rights reserved.