Hi
Please help me to explain the concept of the term "Isolation" used while electrical test of PCBs.I want to know the causes of isolation, as our GM says it always happens because of less pressure i.e 450psi applied to panels while lamination(But recommended pressure is 350 psi).Please explain the other factor i.e baking before lamination etc. is it responsible for that or not?
Thanks
Antonio Gonzeppa