1. The problem leaded by not appropriate choosing and using the auto dry cabinet
The damp air would enter into the IC through the sealed material and lead the internal electric circuit oxidize and decay, and the highly degree temperature within the welding process would make the damp air inside the IC inflate and create pressure, as a result that the plastics is taking off from the chip or the inner part, the chip is damaged, the internal crack and the crack extend to the component's surface is coming out, even the component are damaged and the articles constructed by them are discard. The more important is that the unseen and latent blemish conceals in the product and affects its credibility. Other IC electronics component also exists this kind of problem leaded by damp mostly.
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2. The structure and category of the auto dry box at normal temperature
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3. The important point for choosing the auto dry box at normal temperature meeting with the standard of IPC/JEDEC J-STD-033.
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4. conclusion
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