Thank you for the clarification. Die bonding is most often one of two
types. First is epoxy die attach that uses an organic adhesive that may
or may not be electrically conductive. The second is eutectic die
attach that heats the interface between a silicon die and gold plating,
to just above the silicon/gold eutectic temperature(363 deg. C). There
are some other less common methods. Are you interested in all methods,
or a particulat one?