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Philburt149
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Join Date: May 2009
Posts: 1

SMT Terminals and Solder Pad Mating

05/29/2009 12:53 PM

Hello,

I am designing an SMT component (header with 2 terminals) to be placed on a PCB board with surface pads. The 2 terminal component needs to withstand a 5 lb shock/vibe test in every direction. I am limiting it to 2 terminals to free up board space. I am trying not to use a threaded insert through the middle of the component for added mechanical retention, does anyone know of any documentation or calculations for the mating strength of the surface mount terminal with the surface pads after reflow?

I know it will be dependent on the actual solder joint after reflow, but anything will help.

thanks,

Philip
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JohnDG
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#1

Re: SMT Terminals and Solder Pad Mating

05/29/2009 7:33 PM

No real answers, I'm afraid, but (assuming a conventional PCB) I think the adhesion between the copper foil & the board will be the limiting factor (rather than the terminal/pad soldered joint). My feeling is you'd better bite the bullet, & use some kind of screw mount.

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Jerrell Conway
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Join Date: May 2006
Location: Bahama, NC. USA.
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#2

Re: SMT Terminals and Solder Pad Mating

05/29/2009 11:53 PM

Philip, Sorry no numbers, could you design your part to have a number of tangs that insert into slots in the PCB and either twist or fold over on the back side of the board? If so and these were soldered together then you would have a connection with the maximum strength possible. It would take destruction of the board to free the component. Jerrell

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