Pad Strength for Single Sided PCB

Don't know where you are. Here in USA it used to be Mil-p-55110 or an IPC spec.

Go Fish.

Please let me know the name of material and how much ounce of Copper is there.

Thanks

Naveen

Things to consider: substrate type eg FR-4, thickness, copper thickness, 35/70 uM solder mask, pad size, round, rectangular, holed, before soldering or after, tensile or shear stress???

Suggest "google" for some answers, come back with specifics.

Adhesion strength of Copper plating on epoxy
resin is normally enhanced with barrier metals; such as
with Chromium in thin film polyimide systems, was
anticipated for this built-up process. To enhance the
adhesion of the resin surface, the surface is initially
treated with Potassium Permanganate to create "micro
anchors".

Of these micro anchors. The Ra of the epoxy surface
measured 0.06~0.1 mm for epoxy material and
0.18~0.21 mm for epoxy-acrylate material. Finer micro
anchors are formed on the epoxy surface than the epoxyacrylate
surface.Adhesion strength on micropads for flip
chip attached devices will affect joint reliability between
the device and package. Epoxy-acrylate is chemically
resistant to Potassium Permanganate treatment so the
surface is difficult to form these micro anchors. This
condition results in a weak micropad adhesion strength.
Micro anchors in the epoxy resin surface forms readily and
the adhesion strength meets the specifications. The
adhesion strength of the conductor metalization is directly
related to the material type and susceptibility to Potassium
Permanganate treatment.
Two to three mm micro anchors has a adhesion strength of
2kg/mm2. This value for the adhesion strength will meet
industry specifications based upon the experience gained
on the multilayer thin film Copper/Polyimide technology.
It is also equivalent to 1kg/cm of peel strength for standard
PCB technology.

Just an FYI: If you take Dramamine you won't be karthick -

use biggest pad as poss(chip size). and watch the heat (repairs)