Friends
I am looking for ideas on packaged integrated circuit manufacturing for small amplifiers to be used as hermetically shielded encapsulated modules.
I have few serious problems in the module making here.
---> Low charge measurement require low leakage packaging media
---> High voltage isolation - this can be placed outside the module
---> Capacitance change due to filler media
---> Shielding for the module to avoid interference and pick up.
---> Low temperature coefficient components
---> Low production cost and feasible to produce in 1000 lots.
Is any one having such experience in special electronics and can help this. I have already developed circuits that were done on FR4 double sided PCB and now to be produced in the form of encapsulated and hermetically shielded modules.
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Prof. (Dr.) Shyam, Managing Director for Sensors Technology Private Limited. Gwalior, MP474001, India.