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Guru
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Packaged Integrated Circuit Manufacturing

08/31/2007 10:53 AM

Friends

I am looking for ideas on packaged integrated circuit manufacturing for small amplifiers to be used as hermetically shielded encapsulated modules.

I have few serious problems in the module making here.

---> Low charge measurement require low leakage packaging media

---> High voltage isolation - this can be placed outside the module

---> Capacitance change due to filler media

---> Shielding for the module to avoid interference and pick up.

---> Low temperature coefficient components

---> Low production cost and feasible to produce in 1000 lots.

Is any one having such experience in special electronics and can help this. I have already developed circuits that were done on FR4 double sided PCB and now to be produced in the form of encapsulated and hermetically shielded modules.

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Prof. (Dr.) Shyam, Managing Director for Sensors Technology Private Limited. Gwalior, MP474001, India.
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Anonymous Poster
#1

Re: Packaged Integrated Circuit Manufacturing

09/01/2007 11:43 AM

We are specialists at hermetic sealing using projection welding. Many hermetic sealing technologies are not compatible with FR4 and other organics because they involve the use of elevated temperature. With projection welding, the elevated temperature is so fast and localized that internal components are not affected. You can learn more on http://mysite.verizon.net/tom.es. Alternately, you can do a google search under hermetric and read some of our papers.

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Guru
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#2
In reply to #1

Re: Packaged Integrated Circuit Manufacturing

09/01/2007 11:55 AM

I am working on the process to alter the design to ceramic substrate of Alumina. I will also consider laser welding using short pulses to seal without heating the module.

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Prof. (Dr.) Shyam, Managing Director for Sensors Technology Private Limited. Gwalior, MP474001, India.
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Anonymous Poster
#3
In reply to #2

Re: Packaged Integrated Circuit Manufacturing

09/01/2007 8:25 PM

Projection welding works well, regardless of substrate material. Alumina is better than FR4 because it doesn't absorb water vapor and it has better thermal properties. Laser sealing works, but is expensive and slow compared to projection welding. Depending on the size of packages, projection welding can seal 100 -500 parts per hour - more if automated.

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Guru
India - Member - Sensors Technology Popular Science - Cosmology - Dream, Think and Act United Kingdom - Member - New Member United States - Member - New Member Canada - Member - New Member

Join Date: Aug 2006
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#4
In reply to #3

Re: Packaged Integrated Circuit Manufacturing

09/01/2007 9:54 PM

You are using spot welding and perhaps may be OK for some parts you are doing. I will prefer either 1550nm fiber optic welding in 1ns to 100ns pulses to get desired welding. I have other options also. I will like to own this set up. I can make one.

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Prof. (Dr.) Shyam, Managing Director for Sensors Technology Private Limited. Gwalior, MP474001, India.
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Anonymous Poster
#5
In reply to #4

Re: Packaged Integrated Circuit Manufacturing

09/02/2007 7:20 AM

Our experience indicates that certain amount of energy is required to heat materials for soldering, brazing, welding, etc. The required energy can be delivered at low power for longer time or high power for shorter time. In the limiting cases, one has isothermal heating and perfectly adiabatic heating (vaporization). The heating time you propose (1.0 - 100ns) is good for marking and engraving materials because it ablates the target material away. For joining applications we prefer wider heating pulses in the 1 - 10 ms range. This gives energy time to diffuse into materials to create bulk heating instead of superficial ablation. Our technology is based on projection welding which is a variant of spot welding. The entire seal perimeter is welded with a single pulse. It is much faster than laser welding where the joint is made by a series of overlapping pulses to form a continuous seam.

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Guru
India - Member - Sensors Technology Popular Science - Cosmology - Dream, Think and Act United Kingdom - Member - New Member United States - Member - New Member Canada - Member - New Member

Join Date: Aug 2006
Location: AM-51, Deen Dayal Nagar, Gwalior, Madhya Pradesh, MP 474001, India
Posts: 3418
Good Answers: 32
#6
In reply to #5

Re: Packaged Integrated Circuit Manufacturing

09/03/2007 8:06 AM

Laser pulses are 100ns range and also hit micron size area that easily melts and flows. It is fine quality welding and not a gross welding which needs a lot of material flow. Basically seam is welded and not to large depth. This is an specialized area and not applicable all types of laser welding applications.

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Prof. (Dr.) Shyam, Managing Director for Sensors Technology Private Limited. Gwalior, MP474001, India.
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