I am designing a manifold out of oxygen free copper that will have LN2 running though it. I designed it in two pieces, the bottom part will have channels machined into it that the LN2 would run though but to do this I need to seal the machined channels by placing a top over it and bonding it together. The question I have is what process would I have done so that it becomes a sealed manifold that LN2 can flow through without leaking. Do I silver brazing or solder or is there another way that would be best? Little history, I need to create a manifold that will cool a crystal that is producing about 400W of heat and this is the best way that we have found.
Regards
Ken Stebbins