Refer immediately to manufacturer's recommended conditions for the components that you are using.
Yes, you have hinted that "size does matter" as you need to get all components to a temperature suitable for the soldering reliability to happen. Large components (like THP relays) will have high thermal inertia and may require slower conveyor speeds to achieve sufficient temperature.
One significant note: While you can set the profile of the oven or wave machines using conveyor speed and heater temperatures, it is ESSENTIAL that you verify the ACTUAL temperatures achieved on top and bottom of board through the actual process. We use a "rabbit" board that is loaded with thermocouples to monitor temperature and this goes through the process providing actual readings representative of the product being made. Each product needs its own "rabbit" because the components and heating characteristics can be different.
I am aware of KIC and PROFIT monitoring systems since that's what we use, but there would be others out there that provide similar outcomes.
Basically, conveyors slow enough to ensure everything gets to correct temperature and fast enough that sensitive components don't get roasted.
Gets a little more complicated with double sided SMT boards that are then wavesoldered as some components end up having three heat cycles.
Also, for reflow, the profile is significantly an outcome of the solder paste that you have selected. For us still in lead based soldering it is different than if we were processing lead free SAC materials.
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Just an Engineer from the land down under.
If you follow the recommendation will not go round. You need to adjust belt speed for thermal mass also some time people use loosely pre-heating to set temperature before soldering.
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