The Most Effective Carrier Tape Design Rule for WLCSP's
04/09/2009 7:30 AM
This discussion will focus on the carrier tape design rule formulation for the Wafer Level Chip Scale Packages (WLCSP) especially to those cubic package dimensions.
Re: The Most Effective Carrier Tape Design Rule for WLCSP's
09/06/2011 8:45 PM
This is really small. I'm also working on same dimension of device.
If just refering to the IEC60286 standard (tilting <10deg), it's impossible to design a tape for it considering the tape tolerance. The only solution is to relax the criteria, allow tilting but not flipping of die.
However, the taping process is not stable. Since small devices are more sensitive to tape pocket dimension. Tape suppliers ahve started working on new technology new tapes.
I'd like to know if you have try those tapes, ie. surftape, half-punched tape, etc.
The Most Effective Carrier Tape Design Rule for WLCSP's
Re: The Most Effective Carrier Tape Design Rule for WLCSP's
