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Anonymous Poster

removing Gold ball bond without destroying IC chip pad

04/27/2009 10:30 AM

Does anyone know how to remove Gold ball bonds from a semiconductor without destroying the integrity of the chip? I tried using a gold etchant that is cyanide based but it destroys the paladium and pits the aluminum and copper pads. any Ideas?
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Epke
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#1

Re: removing Gold ball bond without destroying IC chip pad

04/28/2009 12:01 AM

You need a solvent that disolves the bond material, not an etchant

check what bond material is used

http://www.ami.ac.uk/courses/topics/0203_dbm/index.html

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Anonymous Poster
#2
In reply to #1

Re: removing Gold ball bond without destroying IC chip pad

04/28/2009 10:29 AM

thats really not my issue I need to eat away at the gold to leave some left on the pad to re ball bond to it. i dont want to shear it because it scrapes the die. I need to bring it down to about 20 microns and then reattach a new ball to the gold after I run it through some tests.
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Epke
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Popular Science - Weaponology - New Member Netherlands - Member - New Member Fans of Old Computers - Commodore 64 - New Member

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#3

Re: removing Gold ball bond without destroying IC chip pad

04/28/2009 8:38 PM

You could try lasering it that is the only thing i can think of that is accurate enough and leaves the rest unharmed. I know it works on ITO tracks but have never tried it on a gold ball.

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