Hi All
can anybody help mein resolving this ques:
A (100) silicon wafer is subjected to two oxidation steps. In the first step the wafer is placed
in a furnace for dry oxidation at a temperature of 1000°C for 1 hour and 40 minutes. a) Find
the thickness of the oxide layer grown on the silicon wafer? Now the same wafer is oxidized
again, but this time in a wet ambient at a temperature of 900°C for 1 hour and 20 minutes.
B) Find the thickness of the new oxide layer grown on the wafer? C) What is the total
thickness of the oxide on this wafer? D) How much silicon is consumed to make the thermal
oxide layer during the oxidation cycles?