Thermally Conductive Plastic for a CIP Thermoforming Application

Hello,

I am trying to source plastic films for a cut in place thermoforming application. The product that would be created will be used in a air to air plate heat exchanger. The thermal conductivity must be better than 0.2 W/mK (preferably above 1 W/mK). The material should be no thicker than 381 microns. I think the requirement of high thermal conductivity, makes Thermoforming difficult since the plastic would not retain the heat for very long during the forming process. There are some very advanced materials out there with very high thermal conductivity values meeting or exceeding aluminum and steel even, but they all seem to be for a injection molding application.

If anyone has any thoughts or suggestions regarding this application, your comments would be welcome.

Thanks in advance.

Grant Ryan, P.Eng