When you cannot find a "footprint" in your library or an exact footprint in the datasheet for a particular component, obviously you must create the footprint yourself and use some judgement for hole size and solder pad size (both through hole and surface mount). I swear I remember a year ago I found some site that had good guidelines on this stuff, but I am having difficulty finding it.
Here is what I have found:
This is a decent thread from this site:
http://cr4.globalspec.com/thread/37647#comment392663
This wiki gives some good guidelines on the hole:
http://en.wikibooks.org/wiki/Practical_Electronics/PCB_Layout
"A through-hole -- many components (called "through-hole components") require a hole (a "through hole") for each pin. The part manufacturer should specify a "footprint" including the location and size of each hole. If there is no recommendation, common practice is
round leads: add 6 mils to the nominal round lead diameter to get the recommended PCB hole diameter. Rectangular leads: find the lead diagonal (sqrt(x^2 + y^2)). Then add 6 mils to get the recommended PCB hole diameter. ( 6 mils ~= 0.15 mm )[2][3]
"The component lead - hole clearance should be 0,4 mm" [4]
"The optimum pad diameter for a through-hole component is twice its finished hole diameter."[5]"
However I thought I'd seen something that said that solder pad diameter should be 1.7x hole diameter or something like that and something similar for surface mount pads. Anyone have any guidelines they use or rules of thumb, etc.?
"Almost" Good Answers: