Hi, I'm studying on thermal management of microelectronic devices.
Natural and forced convection conditions give high impact on the thermal behaviors of the microelectronics.
I'm quite clear about the natural convection as it can be done in still-air chamber easily.
But I'm not sure about the forced convection. There are few conditions such as water cooled cold plates, heat pipes and variation in air velocity as discussed in some research papers.
How about the usage of thermostat?..Is it considered as forced air convecting tool as it strongly control the package temperature during the DUT operates..Please advice me on this.
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