A recent industry-based collaboration integrated five-layer metal 0.5 micron complementary metal-oxide-semiconductor (CMOS) devices with silicon PIN detector devices. Based on 3D direct bond interconnect (DBI) technology, the novel 3D integrated circuit (IC) is ideal for high-performance imaging applications including focal plane imagers and high-performance sensor arrays.
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Process Integrates 3D Interconnects
Re: Process Integrates 3D Interconnects
