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From The Engineer:
US researchers have developed a surface-topography engineering method that reduces adhesion and stiction in micro-electro-mechanical systems to help parts function smoothly.
'There are two approaches to address adhesion and stiction issues in MEMS devices,' said Min Sou, assistant professor of mechanical engineering. 'One is chemistry - applying chemicals on surfaces to weaken the forces. The other is topography engineering. Our approach was simple. We engineered nanoscale bumps to reduce the contact area between surfaces.'
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