Silver Interconnects Replace Copper on Flexible Circuits

Combining improvements in silver ink technology with advanced printing, a leading connector manufacturer has developed high-performance silver flexible circuits as an economical alternative to traditionally etched copper interconnects on polyimide and printed circuit boards. The newly developed process allows printing fine silver traces (0.13 mm) with equally small spacing (0.13 mm) on polyester substrates. Besides lowering the cost of manufacturing and eliminating the use of harsh chemicals, the silver printing process also allows the attachment of fine-pitch ICs on the polyester substrate using a proprietary bonding technique.

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