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Join Date: Dec 2004
Posts: 1776
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Dissipating heat from future chips

04/19/2005 8:50 AM

mschwartz writes:
Interesting article on new technologies being considered to cool future advanced computer chips. Several universities, lead by Purdue, as well as industry leaders, are collaborating on a center to study these problems. Said Suresh Garimella, a professor of mechanical engineering at Purdue University. "Future computer chips will generate as much as 10 times more heat than today's computer chips, which means we are going to need new cooling technologies." Some of the proposed innovations include miniature temperature sensors, smart power distribution systems and tiny pumps to circulate cooling liquids.

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The Feature Creep

Join Date: Feb 2005
Location: Boston, MA
Posts: 990
#1

Taking the heat....

04/19/2005 9:22 AM

I'm a big believer that diamond will overcome the heat limitations of new chip designs. 81GHz diamond semiconductors have been created and with the rapid availability of man made diamonds man made diamonds the stronger materials will make the need for better heat removal mute.

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Participant

Join Date: Apr 2005
Location: Moscow
Posts: 2
#2

Noise will be a big problem

04/19/2005 5:02 PM

Noise of cooling systems, espesially pumps and fans will be a big problem. All R&D works have to comprise the task of noise reduction by re-profiling of the flow part, using new impeller geometry, testing by CFD-CAA modeling.

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