We are facing some problem with silver plating on copper component.
For silver plating first the component is dipped in AgCN for adding some layer of Ag on the copper so that in the next process when copper is dipped in AgNo3 solution, copper is not lost in AgNo3 & only silver is deposited onto the surface.
Now it is found that when the copper is treated in AgCn, then along with Ag some amount of copper is also getting deposited on the surface, which is not desirable.
What might be the reason for this?