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3D Chip Growth Optimizes Real Estate

Posted February 10, 2016 12:00 AM by Engineering360 eNewsletter

For several years, the inexorable drive to reduce the board real estate that chips occupy while extending device functionality has driven the growth of 3D designs, such as microelectromechanical systems (MEMS), image sensors, and memories, with the layers connected via through-silicon vias (TSVs). The success of such devices has shifted design emphasis to solutions that eliminate the expense of implementing TSVs, and to the software. This item notes that although 2.5D (not quite 3D) will remain popular over stacked-die configurations in some applications for the foreseeable future, true 3D will begin to dominate later this year.


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Power-User

Join Date: Mar 2014
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#1

Re: 3D Chip Growth Optimizes Real Estate

02/15/2016 5:59 PM

Way back when, I was doing electronics 101 with the classic bread board rig of the day. At some point, it occurred to me that at several locations in the circuitry, I could verticalize the component layout and connections. My efforts were shunned by the professor, who had at least a half dozen reasons why 3D patterns were never going to fly. I eventually moved on to the world of 3D engineering, fully convinced of the reasons true 3D circuits (e. g., emulations of the human brain, as was the comparison of my prof) would be beyond the reach of humanity in my lifetime. But if the mavens can devise a quantum computer, then putting all the hardware into a 3D matrix absent signal interference, over-heating and 100 per cent dependable spec validation of the installed components should not be far behind.

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#2

Re: 3D Chip Growth Optimizes Real Estate

05/26/2020 6:50 AM

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