I am looking for help trying to electroplate copper from small bars of impure copper (melted electronic scrap, approx 95% copper) onto copper strips. Have tried several different electroplating solutions (commercial solutions, homemade from internet formulas, and various acid/copper sulfate baths). I am not able to achieve a smooth plating effect, all of my efforts yield copper powder which grows in clumps towards the cathode. I know that copper mines use electroplating to refine their metal, but I have not been able to find useful information on:
1. Chemical composition of electroplating solution
2. Current density and waveform
3. Is temperature critical
4. How important agitation is.
Would appreciate any suggestions and/or useful web sites.
Thanks