Optimal Pressure and Temperature to Cure Thermoset Adhesives?

A few questions to start us off:

You are to "...redesign the application of an adhesive..." because... why?

Is it desired to cure faster? Less adhesive, but equal bond strength? More chemical resistant? An undefined 'better' way to do it?

Sorry, I am trying to not violate any confidentiality of the project so forgive me for lack of some details.

The process is currently manual, and thus the results of the bond strength are varied.

I am trying to automate the process, and am trying to find out if the current method is applying excess pressure or temperature. In other words, given the adhesives we use, I want to design an optimal pressure and temperature application that is automated rather than manual.

So no physical improvement other than consistency improvement.

Thanks for quick response though!

Read the instructions on the container. Depending on the chemistry involved, the cure time and temperature can vary.

As a general rule thin bond lines are preferred, so enough pressure to squeeze out excess adhesive is all that's required.

Cure times will vary depending on relative humidity (for silicones) and temperature.

Read, and follow, the directions on the container.

Unless you are a polymer chemist, the math won't mean anything to you.

There are an incredible number of variations/formulations and properties of even a single type of adhesive.

Therefore, contact manufacturers of the types of adhesives you have in mind. They will know the conditions necessary or allowable to cure their own adhesives.

If this is a hot-melt adhesive, knowing softening temp will be critical. However, even with this information, you will need to do some experimenting with your own equipment to get the optimum temp/pressure combo.

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