Since the ban of lead-containing solder, tin has been used instead, and has presented many problems, one of which is "whiskers".
Pure tin grows whiskers that can short out circuitry, chips, even high current high voltage circuits. Whiskers have also been blamed for a total shutdown of a nuclear power plant. They appear to grow at random, and a cause has not been found, therefore a solution remains elusive. However, some facts are known, such as they tend to grow more frequently at low atmospheric pressure than at sea level. Nice to know when you are cruising at 30,000 feet in autopilot. Some conformal coatings have an effect on reducing, but not eliminating whiskers.
I tend to think of them as a small scale volcanic eruption, with pressure from below forcing the molecules upward. So where does the pressure come from? Residual stresses when cooling(annealing seems to help) or heat cycling?
Is the growing of whiskers accelerated when voltage is applied? It would seem logical as one source of pressure, since electrons tend to repel each other.
At any rate, back to the volcano analogy, there appears to be a weak surface defect, and high subsurface pressure involved.
Any ideas or suggestions are welcome.
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